DIN Type Stripboard SRBP-paper FR2 1.5mm, solder-lacquered<BR/>EPOXY fibre-glass FR4 1.5 mm, hot air levelled (HAL-leadfree)<BR/>Board size 100 x 160 x 1.6mm<BR/>Hole layout 37 x 57<BR/>Hole dia 1.0mm<BR/>Pitch 2.54mm (0.1in)<BR/>Copper thickness 35μm

Laboratory cards for plug connectors, round soldering points, IHK test boards RE60, RE220, RE320, RE525<BR/>Printed circuit boards made from FR2 laminated paper (HP) coated with solder mask<BR/>FR4 epoxy PCBs (LF), lead-free, tin-plated<BR/>Size: 100 x 160 mm (European size)<BR/>Material thickness 1.5 mm<BR/>35 μm copper laminate<BR/>Hole pattern 2.54 x 2.54 mm<BR/>Soldering points Ø 2.1 / 2.2 mm; Hole Ø 1 mm<BR/>RE 60 — test board for communications electricians and IT<BR/>RE525 — Test board for industrial electricians<BR/>RE526 plug connection H15, 36 conductor tracks, positions printed on reverse<BR/>RE527 plug connection for 32 / 64 pins DIN 41612 38 conductor tracks, positions printed on reverse

TSOP I/II Adaptor Boards, RE900 1.5 mm FR4 epoxy, 35 μm CU on both sides<BR/>Plated drill holes, Ø 1 mm<BR/>Soldering and component side surface made of chem. nickel/gold (Ni/Au) and solder mask<BR/>Pre-scored breaking points for detaching individual modules from the board<BR/>Size 72.6 x 76.2 mm<BR/>Adaption board for 14 different SMD TSOP I and 7 different SMD TSOP II chips

D-Sub Connector Labcard SRBP solder lacquered <BR/>Epoxy fibre-glass FR4 1.5mm, hot air levelling (HAL-leadfree)<BR/>2 potential strips<BR/>Stk nos. <a href="/web/p/products/5280419">528-0419</a> & <a href="/web/p/products/3594019">359-4019</a> 2x9-channel and 2x15-channel<BR/>Stk nos. <a href="/web/p/products/5280425">528-0425</a> & <a href="/web/p/products/3594047">359-4047</a> 2x25-channel<BR/>Connector type D-Sub DIN 41652<BR/>Single sided<BR/>Board size 100 x 160 x 1.5mm<BR/>Copper thickness 35μm<BR/>hole pitch 2.54mm (0.1 in)<BR/>Hole dia 1.0mm

RE233-LF Laboratory Card Non-European Format<BR/>Size: 114.3 x 165.1 mm (4.5" x 6.5")<BR/>Material thickness: 1.6 mm FR4 epoxy optical fibre<BR/>Copper coating 35 μm on both sides, with through hole<BR/>Hole pattern: 2.54 x 2.54 mm (1//20")<BR/>40 x 60 bore hole rows<BR/>40 x 56 2 mm² quadratic soldering islands<BR/>Hole diameter: 1.02 mm (0.4")<BR/>Max. Operating temperature: 150 °C (302 °F)

Adapter SOT353 with pins<BR/>Epoxy fibre-glass 1.50 mm<BR/>Double-sided 35 μm Cu<BR/>Plated through holes (PTH)<BR/>Hot air leveling (HAL leadfree)<BR/>Solder stop mask<BR/>Adaption circuit board for SOT353 with 0.65 mm pitch<BR/>With pin header<BR/>Hole spacing 2.54 mm<BR/>Hole diameter 1.10 mm with solder pads Ø 2.10 mm<BR/>Size 11,20 x 13,60 mm

Adapter SOP5 with pins<BR/>Epoxy fibre-glass 1.50 mm<BR/>Double-sided 35 μm Cu<BR/>Plated through holes (PTH)<BR/>Hot air leveling (HAL leadfree)<BR/>Solder stop mask<BR/>Adaption circuit board for SOP5 with 1.27 mm pitch<BR/>With pin header<BR/>Hole spacing 2.54 mm<BR/>Hole diameter 1.10 mm with solder pads Ø 2.10 mm<BR/>Size 10,90 x 14,80 mm

Adapter QFN10 with pins<BR/>Epoxy fibre-glass 1.50 mm<BR/>Double-sided 35 μm Cu<BR/>Plated through holes (PTH)<BR/>Surface chem. Ni/Au<BR/>Solder stop mask<BR/>Adaption circuit board for QFN10 with 0.50 mm pitch<BR/>Pre-soldered pin header<BR/>Hole spacing 2.54 mm<BR/>Hole diameter 1.10 mm with solder pads Ø 2.10 mm<BR/>Size 11,00 x 15,90 mm

Adapter SOP4 with pins<BR/>Epoxy fibre-glass 1.50 mm<BR/>Double-sided 35 μm Cu<BR/>Plated through holes (PTH)<BR/>Hot air leveling (HAL leadfree)<BR/>Solder stop mask<BR/>Adaption circuit board for SOP4 with 2.54 mm pitch<BR/>With pin header<BR/>Hole spacing 2.54 mm<BR/>Hole diameter 1.10 mm with solder pads Ø 2.10 mm<BR/>Size 10,90 x 15,10 mm

Adapter DPAK3 with pins<BR/>Epoxy fibre-glass 1.50 mm<BR/>Double-sided 35 μm Cu<BR/>Plated through holes (PTH)<BR/>Hot air leveling (HAL leadfree)<BR/>Solder stop mask<BR/>Adaption circuit board for DPAK3 with 4.70 mm pitch<BR/>With pin header<BR/>Hole spacing 2.54 mm<BR/>Hole diameter 1.10 mm with solder pads Ø 2.10 mm<BR/>Shield pad & cooling field<BR/>Size 13,50 x 21,50 mm

Adapter MSOP10 with pins<BR/>Epoxy fibre-glass 1.50 mm<BR/>Double-sided 35 μm Cu<BR/>Plated through holes (PTH)<BR/>Hot air leveling (HAL leadfree)<BR/>Solder stop mask<BR/>Adaption circuit board for MSOP10 with 0.50 mm pitch<BR/>With pin header<BR/>Hole spacing 2.54 mm<BR/>Hole diameter 1.10 mm with solder pads Ø 2.10 mm<BR/>Shield pad & cooling field<BR/>Size 15.00 x 15.60 mm

Adapter QFN52 with pins<BR/>Epoxy fibre-glass 1.50 mm<BR/>Double-sided 35 μm Cu<BR/>Plated through holes (PTH)<BR/>Hot air leveling (HAL leadfree)<BR/>Solder stop mask<BR/>Adaption circuit board for QFN52 with 0.40 mm pitch<BR/>With pin header<BR/>Hole spacing 2.54 mm<BR/>Hole diameter 1.10 mm with solder pads Ø 2.10 mm<BR/>Shield pad & cooling field<BR/>Size 23,80 x 66,90 mm