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8330s-21g MG Chemicals Cold Solder Solid Adhesive, 21 g
8330s-21g MG Chemicals Cold Solder Solid Adhesive, 21 g
8330s-21g MG Chemicals Cold Solder Solid Adhesive, 21 g
8330s-21g MG Chemicals Cold Solder Solid Adhesive, 21 g
8330s-21g MG Chemicals Cold Solder Solid Adhesive, 21 g
MG Chemicals Conductive Epoxy The MG Chemicals 21g silver conductive epoxy is a slow cure electronic grade adhesive that bonds to many substrates that are used in electronics assemblies. The adhesive resists thermal and mechanical shocks and has been designed for production environments when high cure temperatures can damage your heat-sensitive components. It has 0.0007ohm-cm electrical resistivity and 1.75W/(m·K) thermal conductivity. Features and Benefits Cure time of 120 minutes
Optimal cure temperature of only 65°C
Easy 1:1 mix ratio
Versatile
High viscosity
Cure time of 60 minutes
No freezing or dry ice required when shipping or storing
Long shelf life
Excellent water and chemical resistance
Effective for gap filling between metal plates
Excellent adhesion to most electronic substrates
Strong water and chemical resistance Applications Use for repair and assembly in optoelectronics and microelectronics
Aerospace
Marine communication
Industrial control equipment industries Certifications RoHS certified
REACH compliant
ANSI/ESD S20.20:2014
BS EN 61340-5-1:2007
MG Chemicals

Cold Solder Solid Adhesive, 21 g

Manufacturer:
MG Chemicals
Manufacturer Part No:
8330S-21G
Enrgtech Part No:
ET12262326
Warranty:
Manufacturer
£ 123.74

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Adhesive Type:

Conductive Epoxy Adhesive

Trade Name:

Cold Solder

Application:

Thermal Management

Material Compatibility:

Metal, Plastic

Product Form:

Solid

Package Type:

Syringe

Package Size:

21 g

Cure Time:

1 h

Viscosity Description:

High Viscosity

Maximum Operating Temperature:

+150°C

Minimum Operating Temperature:

-40°C

Specific Gravity:

3.56