Renesas Electronics Cloud Connectivity Kit The Renesas Electronics cloud connectivity kit is designed for fast prototyping of embedded systems, specifically targeting the Internet of Things applications. This kit includes all the components required for the development and debugging of software that can collect information from a variety of sensors and communicate it securely to the cloud. This kit includes a Wi-Fi board based on the GT202 module that uses Qualcomm QCA4002 system on a chip. Features and Benefits: • A power management based on 3.3V LDO voltage regulator is required for the operation of the microcontroller
• Grove connectors configured to communicate over UART and I2C interface
• Interfacing with other devices over SPI or UART
• J-Link on-board SEGGER debugging probe based on Synergy S124 MCU
• JTAG interface compatible with SEGGER debugging probe
• Quad SPI flash memory for storage of graphics and other digital assets or for execution of code in place (XIP)
• The Synergy S5D9 MCU featuring 2MB code flash/640kb SRAM/64kb data flash
• USB device interface
• User-defined LEDs for indicating the current state of the firmware. Applications: • Electronics laboratories
• Embedded systems
• IoT systems Certifications: • ANSI/ESD S20.20:2014
• BS EN 61340-5-1:2007
• IEEE 802.11 b/g/n