ERNI MicroSpeed 1mm High Speed Signal Connectors MicroSpeed high-speed 1.0 mm pitch BTB header and socket connectors designed for fast data transmission and high signal quality. These MicroSpeed signal connectors can handle high- speed data rates of up to 25 Gbit/s and comply with next generation communications standards including Ethernet 100 Gbit/s (IEEE 802.3ba), Optical Internetworking Forum (OIF) and USB 3.1. The robust frame design of these MicroSpeed high-speed mezzanine PCB connectors enables them to be used in industrial environments. The housings of these MicroSpeed connectors are fully shrouded offering contact protection and resistance to high temperatures. A polarized mating face allows accurate alignment of the MicroSpeed header and socket connectors and safeguards against mismating. The female contacts of the socket connectors feature a dual beam design have a wipe length of 1.5 mm and a reliable connection in rough environments. These MicroSpeed signal connectors also feature EMI/RFI shielding which consists of EMC fingers on the female connector enabling good EMC performance.
Versions of these MicroSpeed high-speed BTB connectors are available with SMT contacts and optional through hole terminals on the shielding. These THT shielded terminals provide a strong mechanical solder joint when the connector is used in industrial applications.
These MicroSpeed high-speed BTB connectors are available with a range of unmated stacking heights (refer to datasheet for details) Features and Benefits Suitable for data rates up to 25 Gbit/s
Robust frame design suitable for industrial environments
Fully shrouded housing for contact protection and high temperature resistance
Polarized mating face for accurate alignment
EMI/RFI shielding
Female sockets with dual beam design for reliable connection
Range of unmated stack heights Applications These MicroSpeed high-speed BTB signal connectors are ideal for use in various applications where high-speed data transmission is required. Applications include data communication, telecommunication, high end computing, medical technology and industrial automation