Molex C-Grid III Interconnection System Connector Housings This range of Connector Housings feature a 2.54 mm pitch and form part of the C-Grid III interconnection system from Molex. This system offers post and receptacle interconnection, with design flexibility and modular components that provide a wide range of interconnection packaging alternatives within the electronic markets. Ideal for use with a wide range of commercial and consumer applications. Features and Benefits • 2.54 mm pitch
• 1 to 80 Circuits
• Dual and single row housing
• Black in colour
• Wire to board configurations and fittings
• Uniform locking system in place on all contacts
• Interchangeable housing styles