The Laird connectivity Lyra series,Dev Kit - BT v5.3 SIP Module includes small form factor PCB modules, as well as ultra-compact SIP options, to suit any host board footprint. Together, Silicon Labs and Laird Connectivity, will drive down your total cost of ownership, design complexity and risk, whilst ensuring you the fastest time to market for your next Bluetooth LE-enabled IoT design. Based on the EFR32BG22 SoC, the Lyra S enables Bluetooth® Low Energy connectivity while delivering best-in-class RF range and performance, future-proof capability for feature and OTA firmware updates, enhanced security features, and low energy consumption. Bluetooth mesh Low Power Node
Built-in antenna
Up to 8 dBm TX power
-98.9 dBm BLE RX sensitivity at 1 Mbps
32-bit ARM Cortex-M33 core at up to 76.8 MHz
512/32 kB of Flash/RAM memory
Optimal selection of MCU peripherals
Up to 24 GPIO pins
12.9 mm x 15.0 m