Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
Heatsink, Universal Square Alu, 17K/W, 31 x 31 x 10mm, Adhesive Foil, Conductive Foil
Manufacturer:
Fischer Elektronik
Manufacturer Part No:
ICK BGA 31x31x10
Enrgtech Part No:
ET14037009
Warranty:
Manufacturer
£ 2.51
Checking for live stock
For Use With:
Universal Square Alu
Length:
31mm
Width:
31mm
Height:
10mm
Dimensions:
31 x 31 x 10mm
Thermal Resistance:
17K/W
Mounting:
Adhesive Foil, Conductive Foil
Colour:
Black
Package Type:
BGA
Material:
Aluminium
3D Model:
https://www.traceparts.com/els/rs-components/en/api/viewer/3d?SupplierID=RS_COMPONENTS&PartNumber=6744762&DisplayLogo=False
