This square package with just 2mm outline combines best performance with a small footprint. A centralized chip allows an easy integration in optical systems. The availability of different main colours and white points gives highest flexibility in various application areas.
Package: white SMT package, colourless clear silicone resin Chip technology: Thinfilm Typ. Radiation: 120° (Lambertian emitter) Colour: ?dom = 632 nm ( super red) ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
