Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
Heatsink, Universal Square Alu, 13.5K/W, 27 x 27 x 22mm, Adhesive Foil, Conductive Foil
Manufacturer:
Fischer Elektronik
Manufacturer Part No:
ICK BGA 27x27x22
Enrgtech Part No:
ET14037008
Warranty:
Manufacturer
£ 9.82
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For Use With:
Universal Square Alu
Length:
27mm
Width:
27mm
Height:
22mm
Dimensions:
27 x 27 x 22mm
Thermal Resistance:
13.5K/W
Mounting:
Adhesive Foil, Conductive Foil
Colour:
Black
Material:
Aluminium
Package Type:
BGA
3D Model:
https://www.traceparts.com/els/rs-components/en/api/viewer/3d?SupplierID=RS_COMPONENTS&PartNumber=6744753&DisplayLogo=False
