The attachable heatsink is designed to provide efficient heat dissipation for TO 220 transistors. With a narrow design and varied dissipation power lengths, it takes up minimal space while ensuring optimum heat transfer. Narrow version with better thermal resistance3 different lengths for varied dissipation powerSimple assembly by pushing the heatsink onto the TO 220 housingCooling fingers form spring clamps for constant pressure on the entire contact surfaceEffective heat emission with horizontal and vertical mountingAluminium material with black anodised surface for durability and heat dissipation

Fischer Elektronik Cooling Aggregates with Axial Fans Fischer Elektronik cooling aggregates with fitted axial fans offer a versatile and efficient cooling solution in high powered applications where heat dissipation is only possible by forced convection. With a range of sizes to suit an array of requirements, Fischer Elektronik cooling aggregates are ideal. Geometry of optimising the airflowParticularly effective heat dissipationCompact constructionMilled flat semiconductor mounting surface

The precision female header product offers high-quality contacts for pin cross sections of 0.5 mm. With a variety of surface contact options and contact spring materials, this product ensures reliable connectivity for user's PCB connectors. High-precision female headers with precision contactsVariety of surface contact options for different needsContact sleeve made of Ni+4...6μm Sn for durabilityInner contact spring with Ni+0,75μm Au surface for optimal performanceSuitable for plugability for circuit points and various insert depthsIdeal for applications requiring shock and vibration resistanceOffers low volume resistance and capacity between contacts for efficient performance

ICK S R Series Round heatsinks for ICs, which are also designed for use with LEDs (see also ICK LED R heatsinks, typical SN 674-4771 ) Al-natural surfaceMounting by clamp, foil or adhesive

Fischer Elektronik ICK BGA Series Heatsink ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included). Features and BenefitsBlack anodised surface.Heatsink dimensions match respective BGA-type.Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).

SK 89 Extrusion Heatsink The SK 89 heatsink comes with guide grooves for access panels or printed circuit boards and is available in 75 mm and 100 mm lengths. The SSR types can be snapped straight onto the 35 mm DIN rail, and threaded holes are also provided for mounting components.

GBM4070.15 - Spacer with internal and external thread

ICK S Series Square heatsinks for ICs Al-natural surfaceMounting by clamp, foil or adhesive

GBM 3050 10 - Spacer with internal and external thread

ICK Series Heatsinks for Pentium and PGAs Black anodised surface finish

Thermal Polyimide Heatsink Discs Thermally conductive foil discsDouble-sided adhesive layersReplaces mechanical fastenings

Fischer Elektronik ICK BGA Series Heatsink ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included). Features and BenefitsBlack anodised surface.Heatsink dimensions match respective BGA-type.Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).