The Infineon technologies introduces Double DPAK (DDPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology 600V CoolMOS™ G7 superjunction (SJ) MOSFET is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
Enabling highest energy efficiency
Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
Reduced parasitic source inductance improves efficiency and ease-of-use
Enables higher power density solutions
Exceeding the highest quality standards
Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
Reduced parasitic source inductance improves efficiency and ease-of-use
Enables higher power density solutions
Exceeding the highest quality standards
N-Channel MOSFET, 13 A, 600 V, 10-Pin DDPAK IPDD60R190G7XTMA1
Manufacturer:
Infineon
Manufacturer Part No:
IPDD60R190G7XTMA1
Enrgtech Part No:
ET21632917
Warranty:
Manufacturer
£ 0.69
Checking for live stock
Channel Type:
N
Maximum Continuous Drain Current:
13 A
Maximum Drain Source Voltage:
600 V
Series:
CoolMOS™ G7
Package Type:
DDPAK
Mounting Type:
Surface Mount
Pin Count:
10
Maximum Drain Source Resistance:
190 mΩ
Channel Mode:
Enhancement
Maximum Gate Threshold Voltage:
4V
Number of Elements per Chip:
1
Transistor Material:
Si
