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Fortex
Fortex
Fortex
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Ss100-1, Single-Sided Copper Clad Board Fr4 With 35Μm Copper Thick, 100 X 220 X 1.55Mm

The Fortex Raw Copper Clad comes with single sided FR4 glass fibre laminate. It is designed for various PCB fabrication methods, including CNC isolation routing, drilling, and imaging techniques like LDI and screen printing. It supports dry film laminators and etch resist transfers, ensuring versatility in production. Manufactured and tested per IPC4101C/21 standards for quality and reliability. 35 dissipation factor<BR/>5.4 dielectric constant<BR/>Excellent heat resistance and mechanical properties

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Ss233, Single-Sided Copper Clad Board Fr4 With 35Μm Copper Thick, 233.4 X 160 X 1.55Mm

The Fortex Raw Copper Clad comes with single sided FR4 glass fibre laminate. It is designed for various PCB fabrication methods, including CNC isolation routing, drilling, and imaging techniques like LDI and screen printing. It supports dry film laminators and etch resist transfers, ensuring versatility in production. Manufactured and tested per IPC4101C/21 standards for quality and reliability. 35 dissipation factor<BR/>5.4 dielectric constant<BR/>Excellent heat resistance and mechanical properties

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Ds60, Double-Sided Copper Clad Board Fr4 With 35/35Μm Copper Thick, 100 X 60 X 1.55Mm

The Fortex Raw Copper Clad comes with double sided FR4 glass fibre laminate. It is designed for various PCB fabrication methods, including CNC isolation routing, drilling, and imaging techniques like LDI and screen printing. It supports dry film laminators and etch resist transfers, ensuring versatility in production. Manufactured and tested per IPC4101C/21 standards for quality and reliability. 35 dissipation factor<BR/>5.4 dielectric constant<BR/>Excellent heat resistance and mechanical properties

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Ss203, Single-Sided Copper Clad Board Fr4 With 35Μm Copper Thick, 203 X 114 X 1.55Mm

The Fortex Raw Copper Clad comes with single sided FR4 glass fibre laminate. It is designed for various PCB fabrication methods, including CNC isolation routing, drilling, and imaging techniques like LDI and screen printing. It supports dry film laminators and etch resist transfers, ensuring versatility in production. Manufactured and tested per IPC4101C/21 standards for quality and reliability. 35 dissipation factor<BR/>5.4 dielectric constant<BR/>Excellent heat resistance and mechanical properties

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Ds100, Double-Sided Copper Clad Board Fr4 With 35/35Μm Copper Thick, 100 X 160 X 1.55Mm

The Fortex Raw Copper Clad comes with double sided FR4 glass fibre laminate. It is designed for various PCB fabrication methods, including CNC isolation routing, drilling, and imaging techniques like LDI and screen printing. It supports dry film laminators and etch resist transfers, ensuring versatility in production. Manufactured and tested per IPC4101C/21 standards for quality and reliability. 35 dissipation factor<BR/>5.4 dielectric constant<BR/>Excellent heat resistance and mechanical properties

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Ds100-1, Double-Sided Copper Clad Board Fr4 With 35/35Μm Copper Thick, 100 X 220 X 1.55Mm

The Fortex Raw Copper Clad comes with double sided FR4 glass fibre laminate. It is designed for various PCB fabrication methods, including CNC isolation routing, drilling, and imaging techniques like LDI and screen printing. It supports dry film laminators and etch resist transfers, ensuring versatility in production. Manufactured and tested per IPC4101C/21 standards for quality and reliability. 35 dissipation factor<BR/>5.4 dielectric constant<BR/>Excellent heat resistance and mechanical properties

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Ds233, Double-Sided Copper Clad Board Fr4 With 35/35Μm Copper Thick, 233.4 X 160 X 1.55Mm

The Fortex Raw Copper Clad comes with double sided FR4 glass fibre laminate. It is designed for various PCB fabrication methods, including CNC isolation routing, drilling, and imaging techniques like LDI and screen printing. It supports dry film laminators and etch resist transfers, ensuring versatility in production. Manufactured and tested per IPC4101C/21 standards for quality and reliability. 35 dissipation factor<BR/>5.4 dielectric constant<BR/>Excellent heat resistance and mechanical properties

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Ds203, Double-Sided Copper Clad Board Fr4 With 35/35Μm Copper Thick, 203 X 114 X 1.55Mm

The Fortex Raw Copper Clad comes with double sided FR4 glass fibre laminate. It is designed for various PCB fabrication methods, including CNC isolation routing, drilling, and imaging techniques like LDI and screen printing. It supports dry film laminators and etch resist transfers, ensuring versatility in production. Manufactured and tested per IPC4101C/21 standards for quality and reliability. 35 dissipation factor<BR/>5.4 dielectric constant<BR/>Excellent heat resistance and mechanical properties

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Fortex 250Pdig Digital Soldering Station 1200W, 220V 450°C

The Fortex Temperature soldering station units use a high quality Aluminium alloy heating plate, the surface is treated with diamond wire drawing, resulting in a smooth and wear-resistant surface. Intelligent constant temperature, high temperature heating is safer and is more reliable. Small benchtop footprint<BR/>PID digital temperature controller with two digital displays showing set temperature and actual temperature

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Fortex Hd5-Mic Usb 2.0 Digital Microscope, 51 Mp, 4.5X Magnification

The Fortex Microscope examine your PCB circuits with high precision and solder even the smallest SMDs and elements without any hassle using the Full HD 51Mp camera system with 180x lens. Multifunctional HDMI Digital Microscope features Full HD<BR/>Supplied with stand and LED ring illumination

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Fortex Blue Etch Resist Ink Pen

Economy Permanent Waterproof Ink Pen A permanent water-proof pen containing ink which has etch resist properties<BR/>Circuits can be drawn on plain copper laminate and then etched in Ferric Chloride

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600-014, Sodium Peroxydisulfate Etching Chemical For Etching In Crystals

PCB Preparation Fine Etch Crystals An effective alternative to Ferric Chloride, this etchant eliminates the staining and mess caused by traditional etchants<BR/>The mixed solution remains odourless and any splashes or drips can be wiped away with a damp cloth, preventing staining<BR/>6-8 minute etching times at 50°C should be expected with fresh solution<BR/>4-6 week life expected in tank (can be increased by adding a little more powder to exhausted solution)<BR/>Supplied in 1kg powder bag sufficient to make 5 litres of etching solution<BR/>Based on a Sodium Persulphate and Stabiliser formula

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