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BGA Chipset TALON™ Clips TALON™ Clips are a new way of mounting and fixing Malico BGA heatsinks<BR/>Heatsinks easily snap into place and self-align with no need for additional holes or mounting<BR/>Firm and uniform mount that is resilient to vibration and minor impacts <BR/>Claw fixes between board and BGA package<BR/>Different coloured clips to cover the wide range of BGA packages
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BGA Chipset TALON™ Clips TALON™ Clips are a new way of mounting and fixing Malico BGA heatsinks<BR/>Heatsinks easily snap into place and self-align with no need for additional holes or mounting<BR/>Firm and uniform mount that is resilient to vibration and minor impacts <BR/>Claw fixes between board and BGA package<BR/>Different coloured clips to cover the wide range of BGA packages
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BGA Chipset TALON™ Clips TALON™ Clips are a new way of mounting and fixing Malico BGA heatsinks<BR/>Heatsinks easily snap into place and self-align with no need for additional holes or mounting<BR/>Firm and uniform mount that is resilient to vibration and minor impacts <BR/>Claw fixes between board and BGA package<BR/>Different coloured clips to cover the wide range of BGA packages
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BGA Chipset TALON™ Clips TALON™ Clips are a new way of mounting and fixing Malico BGA heatsinks<BR/>Heatsinks easily snap into place and self-align with no need for additional holes or mounting<BR/>Firm and uniform mount that is resilient to vibration and minor impacts <BR/>Claw fixes between board and BGA package<BR/>Different coloured clips to cover the wide range of BGA packages
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BGA Chipset TALON™ Clips TALON™ Clips are a new way of mounting and fixing Malico BGA heatsinks<BR/>Heatsinks easily snap into place and self-align with no need for additional holes or mounting<BR/>Firm and uniform mount that is resilient to vibration and minor impacts <BR/>Claw fixes between board and BGA package<BR/>Different coloured clips to cover the wide range of BGA packages
Show Details
BGA Chipset TALON™ Clips TALON™ Clips are a new way of mounting and fixing Malico BGA heatsinks<BR/>Heatsinks easily snap into place and self-align with no need for additional holes or mounting<BR/>Firm and uniform mount that is resilient to vibration and minor impacts <BR/>Claw fixes between board and BGA package<BR/>Different coloured clips to cover the wide range of BGA packages
Show Details
BGA Chipset TALON™ Clips TALON™ Clips are a new way of mounting and fixing Malico BGA heatsinks<BR/>Heatsinks easily snap into place and self-align with no need for additional holes or mounting<BR/>Firm and uniform mount that is resilient to vibration and minor impacts <BR/>Claw fixes between board and BGA package<BR/>Different coloured clips to cover the wide range of BGA packages
Show Details
BGA Chipset TALON™ Clips TALON™ Clips are a new way of mounting and fixing Malico BGA heatsinks<BR/>Heatsinks easily snap into place and self-align with no need for additional holes or mounting<BR/>Firm and uniform mount that is resilient to vibration and minor impacts <BR/>Claw fixes between board and BGA package<BR/>Different coloured clips to cover the wide range of BGA packages
Show DetailsBGA Chipset Heat Sinks High-performance precision-forged clip-attachment heatsinks for BGA chipsets. AL6063 grade aluminium at 201 W/m K thermal conductivity<BR/>Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance<BR/>Attachment by plastic clip<BR/>Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
Show DetailsBGA Chipset Heat Sinks High-performance precision-forged clip-attachment heatsinks for BGA chipsets. AL6063 grade aluminium at 201 W/m K thermal conductivity<BR/>Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance<BR/>Attachment by plastic clip<BR/>Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
Show DetailsBGA Chipset Heat Sinks High-performance precision-forged clip-attachment heatsinks for BGA chipsets. AL6063 grade aluminium at 201 W/m K thermal conductivity<BR/>Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance<BR/>Attachment by plastic clip<BR/>Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
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BGA Chipset Heat Sinks High-performance precision-forged clip-attachment heatsinks for BGA chipsets. AL6063 grade aluminium at 201 W/m K thermal conductivity<BR/>Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance<BR/>Attachment by plastic clip<BR/>Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
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