LF318 Lead Free Solder paste Unleaded, No-Clean, Halide-free, pin-testable, humidity resistant solder paste, ideal for Electronics Lead-Free processes & re-work. Wide print process and reflow windows<BR/>Long abandon time<BR/>Low slump<BR/>Clear colourless residues<BR/>High tack & SIR<BR/>Particle size 20-45μm<BR/>No corrosion<BR/>Supplied in 500g tubs

High Melting Point (H.M.P.) Solder Ideal for joints which will not be affected during the soldering and reflowing of other nearby joints made with lower temperature solders. 5 cores of Ersin® flux

40//60 Tin/Lead Solder This solder is more suitable for making/repairing copper and brass metalware. 5 cores of Ersin® flux

40//60 Tin/Lead Solder This solder is more suitable for making/repairing copper and brass metalware. 5 cores of Ersin® flux

No Clean De-soldering Wick This no-clean wick (supplied in an antistatic box) dispenses with the need for any sort of cleaning after de-soldering. The copper braiding is covered in a synthetic resin (without halogen) which facilitates more rapid absorption of the solder, leaving behind a negligible quantity of non-corrosive & non-hygroscopic residue

No Clean De-soldering Wick This no-clean wick (supplied in an antistatic box) dispenses with the need for any sort of cleaning after de-soldering. The copper braiding is covered in a synthetic resin (without halogen) which facilitates more rapid absorption of the solder, leaving behind a negligible quantity of non-corrosive & non-hygroscopic residue

No Clean De-soldering Wick This no-clean wick (supplied in an antistatic box) dispenses with the need for any sort of cleaning after de-soldering. The copper braiding is covered in a synthetic resin (without halogen) which facilitates more rapid absorption of the solder, leaving behind a negligible quantity of non-corrosive & non-hygroscopic residue