QFP Converter Board Solder the IC to the centre of the board, then bring wires out from the nearby lands<BR/>Use ICs with fewer pins in the centre of the pattern<BR/>Please note that some ICs cannot be used due to pin placement etc.

Double-Sided Tape for Heat Dissipation Parts can be fixed in place, with efficient heat dissipation, simply by taping<BR/>Can be used on a wide variety of objects<BR/>Silicon thermal compound not required for heat dissipation

Compact Universal Board SEG type is the optimum common earth type for high-frequency circuits<BR/>2.54 mm pitch, board installation hole Ø 4 → 3.2

Compact Universal Board SEG type is the optimum common earth type for high-frequency circuits<BR/>2.54 mm pitch, board installation hole Ø 4 → 3.2

Compact Universal Board SEG type is the optimum common earth type for high-frequency circuits<BR/>2.54 mm pitch, board installation hole Ø 4 → 3.2

Compact Universal Board 93SG 2.54 mm pitch, board installation hole Ø 4 → 3.2

Compact Universal Board SEG type is the optimum common earth type for high-frequency circuits<BR/>2.54 mm pitch, board installation hole Ø 4 → 3.2

Medium-Sized Universal Board 2.54 mm pitch, board installation hole Ø 4 → 3.2

Compact Universal Board SEG type is the optimum common earth type for high-frequency circuits<BR/>2.54 mm pitch, board installation hole Ø 4 → 3.2