Syfer MLCC 1812 Suitable for all general purpose and high reliability applications<BR/>All are manufactured using Syfer&#146;s unique wet process and incorporate precious metal electrodes

Syfer MLCC 1206 Suitable for all general purpose and high reliability applications<BR/>All are manufactured using Syfer&#146;s unique wet process and incorporate precious metal electrodes

Syfer MLCC 1812 Suitable for all general purpose and high reliability applications<BR/>All are manufactured using Syfer&#146;s unique wet process and incorporate precious metal electrodes

Syfer MLCC 1812 Suitable for all general purpose and high reliability applications<BR/>All are manufactured using Syfer&#146;s unique wet process and incorporate precious metal electrodes

0805//1806 Series 3 terminal chips suitable for EMI suppression in digital circuits and other signal lines<BR/>C0G (MCE suffix) and X7R (MXE suffix) dielectric types are available<BR/>Silver termination base with Ni Barrier ( 100% matte Sn finish )

0805//1806 Series 3 terminal chips suitable for EMI suppression in digital circuits and other signal lines<BR/>C0G (MCE suffix) and X7R (MXE suffix) dielectric types are available<BR/>Silver termination base with Ni Barrier ( 100% matte Sn finish )

Syfer 250Vac non safety Flexicap Provides a solution for use at up to 250Vac 60Hz continuous use and provides for non safety-critical applications

Syfer Flexicap 1812 FlexiCap™ has been developed as a result of listening to customers&#146; experiences of stress damage to MLCCs<BR/>A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish<BR/>FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors<BR/>An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking<BR/>FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes

Syfer Flexicap 2220 FlexiCap™ has been developed as a result of listening to customers&#146; experiences of stress damage to MLCCs<BR/>A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish<BR/>FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors<BR/>An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking<BR/>FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes

Syfer Flexicap 1808 FlexiCap™ has been developed as a result of listening to customers&#146; experiences of stress damage to MLCCs<BR/>A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish<BR/>FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors<BR/>An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking<BR/>FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes

Syfer Flexicap 0805 FlexiCap™ has been developed as a result of listening to customers&#146; experiences of stress damage to MLCCs<BR/>A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish<BR/>FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors<BR/>An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking<BR/>FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes

Syfer Flexicap 0603 FlexiCap™ has been developed as a result of listening to customers&#146; experiences of stress damage to MLCCs<BR/>A proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finish<BR/>FlexiCapT™ will accommodate a greater degree of board bending than conventional capacitors<BR/>An additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without cracking<BR/>FlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes