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Syfer Flexicap 1812 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCsA proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finishFlexiCapT™ will accommodate a greater degree of board bending than conventional capacitorsAn additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without crackingFlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
Show DetailsSyfer Flexicap 0805 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCsA proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finishFlexiCapT™ will accommodate a greater degree of board bending than conventional capacitorsAn additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without crackingFlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
Show DetailsSyfer Flexicap 1206 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCsA proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finishFlexiCapT™ will accommodate a greater degree of board bending than conventional capacitorsAn additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without crackingFlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
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Syfer Flexicap 2220 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCsA proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finishFlexiCapT™ will accommodate a greater degree of board bending than conventional capacitorsAn additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without crackingFlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
Show DetailsSyfer MLCC 1812 Suitable for all general purpose and high reliability applicationsAll are manufactured using Syfer’s unique wet process and incorporate precious metal electrodes
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Syfer MLCC 1206 Suitable for all general purpose and high reliability applicationsAll are manufactured using Syfer’s unique wet process and incorporate precious metal electrodes
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Syfer Flexicap 0805 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCsA proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finishFlexiCapT™ will accommodate a greater degree of board bending than conventional capacitorsAn additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without crackingFlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
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0805//1806 Series 3 terminal chips suitable for EMI suppression in digital circuits and other signal linesC0G (MCE suffix) and X7R (MXE suffix) dielectric types are availableSilver termination base with Ni Barrier ( 100% matte Sn finish )
Show DetailsSyfer Flexicap 0603 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCsA proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finishFlexiCapT™ will accommodate a greater degree of board bending than conventional capacitorsAn additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without crackingFlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
Show DetailsSyfer Flexicap 0603 FlexiCap™ has been developed as a result of listening to customers’ experiences of stress damage to MLCCsA proprietary flexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier finishFlexiCapT™ will accommodate a greater degree of board bending than conventional capacitorsAn additional benefit of FlexiCap™ is that MLCCs can withstand temperature cycling -55ºC to 125ºC in excess of 1000 times without crackingFlexiCap™ may be soldered using your traditional wave or reflow solder techniques and needs no adjustment to equipment or current processes
Show DetailsSyfer 250Vac non safety Flexicap Provides a solution for use at up to 250Vac 60Hz continuous use and provides for non safety-critical applications
Show DetailsSyfer MLCC 1812 Suitable for all general purpose and high reliability applicationsAll are manufactured using Syfer’s unique wet process and incorporate precious metal electrodes
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