SP485EMN-L-TR Exar Corporation SP485EMN-L/TR

This is manufactured by Exar Corporation. The manufacturer part number is SP485EMN-L/TR. Its typical moisture sensitivity level is 1 (unlimited). It features 1/1 transceiver half rs422, rs485 8-soic. It also includes 1/1. The product features a rs422, rs485 protocol. The product is available in surface mount configuration. Regarding duplex options, it is half. It is available in the standard package of 1. Moreover, the product comes in [Package/ Case]. 8-soic is the supplier device package value. Features 20mv of receiver hysteresis. In addition, cut tape (ct) is the available packaging type of the product. Furthermore, the product is discontinued at digi-key The product has -40°c ~ 125°c operating temperature range. It has optimum voltage supply of 4.75 v ~ 5.25 v. It has a maximised data speed rate of 10mbps. It comes in transceiver configuration. Alternative Names include 1016-1828-1. The exar corporation's product offers user-desired applications.

RoHs Compliant

Exar Corporation SP485EMN-L/TR

Manufacturer:
Exar Corporation
Manufacturer Part No:
SP485EMN-L/TR
Enrgtech Part No:
ET11286503
Warranty:
Manufacturer
£ 0.85
Checking for live stock
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Detailed Description:
1/1 Transceiver Half RS422, RS485 8-SOIC
Number of Drivers/Receivers:
1/1
Protocol:
RS422, RS485
Mounting Type:
Surface Mount
Duplex:
Half
Standard Package:
1
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Supplier Device Package:
8-SOIC
Receiver Hysteresis:
20mV
Packaging:
Cut Tape (CT)
Part Status:
Discontinued at Digi-Key
Operating Temperature:
-40°C ~ 125°C
Voltage - Supply:
4.75 V ~ 5.25 V
Data Rate:
10Mbps
Type:
Transceiver
Other Names:
1016-1828-1
Manufacturer:
Exar Corporation
pdf icon
Alt Site 19/Dec/2016(PCN Assembly/Origin)
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Location Chg 5/Jan/2016(PCN Assembly/Origin)
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TSMC Foundry Qualification 13/Jul/2015(PCN Assembly/Origin)
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Alternate Assembly Subcon 28/Apr/2016(PCN Assembly/Origin)
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Datasheet Correction 16/Aug/2013(PCN Design/Specification)
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Copper Wire Bonding 02/Jul/2013(PCN Design/Specification)


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