LM4881MX-NOPB Texas Instruments LM4881MX/NOPB

This is manufactured by Texas Instruments. The manufacturer part number is LM4881MX/NOPB. It has typical 12 weeks of manufacturer standard lead time. Its typical moisture sensitivity level is 1 (unlimited). It features amplifier ic headphones, 2-channel (stereo) class ab 8-soic. The splendid features of the product include shutdown, thermal protection. The product is available in surface mount configuration. Furthermore, the product is active The product boomer®, is a highly preferred choice for users. It is available in the standard package of 1. 8-soic is the supplier device package value. Furthermore, it has aheadphones, 2-channel (stereo) output. In addition, cut tape (ct) is the available packaging type of the product. The product has -40°c ~ 85°c (ta) operating temperature range. It has optimum voltage supply of 2.7 v ~ 5.5 v. Moreover, the product comes in [Package/ Case]. It has a maximum output power into channels at given loads, such as 300mw x 2 @ 8 ohm. It comes in class ab configuration. Alternative Names include 296-38130-1. The texas instruments's product offers user-desired applications.

RoHs Compliant

Texas Instruments LM4881MX/NOPB

Manufacturer:
Texas Instruments
Manufacturer Part No:
LM4881MX/NOPB
Enrgtech Part No:
ET11538664
Warranty:
Manufacturer
£ 1.18
Checking for live stock
Manufacturer Standard Lead Time:
12 Weeks
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Detailed Description:
Amplifier IC Headphones, 2-Channel (Stereo) Class AB 8-SOIC
Features:
Shutdown, Thermal Protection
Mounting Type:
Surface Mount
Part Status:
Active
Series:
Boomer®
Standard Package:
1
Supplier Device Package:
8-SOIC
Output Type:
Headphones, 2-Channel (Stereo)
Packaging:
Cut Tape (CT)
Operating Temperature:
-40°C ~ 85°C (TA)
Voltage - Supply:
2.7 V ~ 5.5 V
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Max Output Power x Channels @ Load:
300mW x 2 @ 8 Ohm
Type:
Class AB
Other Names:
296-38130-1
Manufacturer:
Texas Instruments
pdf icon
LM4881(Datasheets)
pdf icon
SOIC Pkg Wire Bonding Update 24/Jul/2013(PCN Design/Specification)


Alternative products


Product Reviews