MCP6422-E-MS Microchip Technology MCP6422-E/MS

This is manufactured by Microchip Technology. The manufacturer part number is MCP6422-E/MS. It has typical 6 weeks of manufacturer standard lead time. It features general purpose amplifier 2 circuit rail-to-rail 8-msop. Furthermore, the product is active The product has -40°c ~ 125°c operating temperature range. It features a typical 1.8 v ~ 5.5 v voltage of single or dual. Moreover, the product comes in [Package/ Case]. The typical current - input bias includes 1pa. Base Part Number: mcp6422. Furthermore, it has arail-to-rail output. The current - supply of a bespoke product is 4.4µa. It is available in the standard package of 100. The microchip technology's product offers user-desired applications. Its typical moisture sensitivity level is 1 (unlimited). The input offset voltage is 1mv. It integrates 2 circuits. The gain bandwidth product is 90khz. The product is available in surface mount configuration. 8-msop is the supplier device package value. In addition, tube is the available packaging type of the product. The 0.05 v/µs is the slew rate of the product. It is a sort of a general purpose amplifier.

RoHs Compliant

Microchip Technology MCP6422-E/MS

Manufacturer:
Microchip Technology
Manufacturer Part No:
MCP6422-E/MS
Enrgtech Part No:
ET12305189
Warranty:
Manufacturer
£ 0.56
Checking for live stock
Manufacturer Standard Lead Time:
6 Weeks
Detailed Description:
General Purpose Amplifier 2 Circuit Rail-to-Rail 8-MSOP
Part Status:
Active
Operating Temperature:
-40°C ~ 125°C
Voltage - Supply, Single/Dual (±):
1.8 V ~ 5.5 V
Package / Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Current - Input Bias:
1pA
Base Part Number:
MCP6422
Output Type:
Rail-to-Rail
Current - Supply:
4.4µA
Standard Package:
100
Manufacturer:
Microchip Technology
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Voltage - Input Offset:
1mV
Number of Circuits:
2
Gain Bandwidth Product:
90kHz
Mounting Type:
Surface Mount
Supplier Device Package:
8-MSOP
Packaging:
Tube
Slew Rate:
0.05 V/µs
Amplifier Type:
General Purpose
pdf icon
Bond Wire 29/Nov/2017(PCN Assembly/Origin)
pdf icon
Mult Devices 28/Nov/2017(PCN Assembly/Origin)
pdf icon
Bond Wire Qualification 08/Jun/2016(PCN Design/Specification)
pdf icon
Packing Changes 10/Oct/2016(PCN Packaging)


Alternative products


Product Reviews