SY89222LMG-TR Microchip Technology

This is manufactured by Microchip Technology. The manufacturer part number is SY89222LMG-TR. It has typical 6 weeks of manufacturer standard lead time. The translator is a mixed signal type. It features mixed signal translator unidirectional 1 circuit 2 channel 8-mlf® (2x2). Furthermore, the product is active The product has -40°c ~ 85°c (ta) operating temperature range. Moreover, the product comes in [Package/ Case]. Base Part Number: 89222. It has ttl input signal. Furthermore, it has adifferential output. pecl output signal. It is available in the standard package of 1. The microchip technology's product offers user-desired applications. The product is available in [Cannel Type] channel. Its typical moisture sensitivity level is 1 (unlimited). It integrates 1 circuits. It includes 2 channels per circuit. The product is available in surface mount configuration. The product sy89, is a highly preferred choice for users. 8-mlf® (2x2) is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. Alternative Names include 576-2947-1.

RoHs Compliant

Microchip Technology SY89222LMG-TR

Manufacturer:
Microchip Technology
Manufacturer Part No:
SY89222LMG-TR
Enrgtech Part No:
ET11448396
Warranty:
Manufacturer
£ 3.12
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Manufacturer Standard Lead Time:
6 Weeks
Translator Type:
Mixed Signal
Detailed Description:
Mixed Signal Translator Unidirectional 1 Circuit 2 Channel 8-MLF® (2x2)
Part Status:
Active
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
8-VFDFN Exposed Pad, 8-MLF®
Base Part Number:
89222
Input Signal:
TTL
Output Type:
Differential
Output Signal:
PECL
Standard Package:
1
Manufacturer:
Microchip Technology
Channel Type:
Unidirectional
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Number of Circuits:
1
Channels per Circuit:
2
Mounting Type:
Surface Mount
Series:
SY89
Supplier Device Package:
8-MLF® (2x2)
Packaging:
Cut Tape (CT)
Other Names:
576-2947-1
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MEC5105K 24/Oct/2017(PCN Assembly/Origin)
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Fab Site 14/Oct/2016(PCN Assembly/Origin)
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Wafer Size Update 02/Sep/2015(PCN Assembly/Origin)
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995 (UK2011-EN PDF)(Catalog Page)
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Packing Changes 10/Oct/2016(PCN Packaging)


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