MR256A08BYS35 Everspin Technologies Inc.

This is manufactured by Everspin Technologies Inc.. The manufacturer part number is MR256A08BYS35. It has typical 10 weeks of manufacturer standard lead time. It is a type of non-volatile memory type. It features mram (magnetoresistive ram) memory ic 256kb (32k x 8) parallel 35ns 44-tsop2. The product is available in surface mount configuration. Furthermore, the product is active It is available in the standard package of 135. It is a parallel memory interface. 44-tsop2 is the supplier device package value. Its typical moisture sensitivity level is 3 (168 hours). It allows a 35ns of write cycle time. In addition, tray is the available packaging type of the product. The product has 0°c ~ 70°c (ta) operating temperature range. It holds a typical memory size of 256kb (32k x 8). It has optimum voltage supply of 3 v ~ 3.6 v. Moreover, the product comes in [Package/ Case]. It is a sort of ram memory. This product use mram (magnetoresistive ram) technology. Alternative Names include 819-1024. It allows 35ns access time. The everspin technologies inc.'s product offers user-desired applications.

RoHs Compliant

Everspin Technologies Inc. MR256A08BYS35

Manufacturer:
Everspin Technologies Inc.
Manufacturer Part No:
MR256A08BYS35
Enrgtech Part No:
ET12031110
Warranty:
Manufacturer
£ 4.35
Checking for live stock
Manufacturer Standard Lead Time:
10 Weeks
Memory Type:
Non-Volatile
Detailed Description:
MRAM (Magnetoresistive RAM) Memory IC 256Kb (32K x 8) Parallel 35ns 44-TSOP2
Mounting Type:
Surface Mount
Part Status:
Active
Standard Package:
135
Memory Interface:
Parallel
Supplier Device Package:
44-TSOP2
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Write Cycle Time - Word, Page:
35ns
Packaging:
Tray
Operating Temperature:
0°C ~ 70°C (TA)
Memory Size:
256Kb (32K x 8)
Voltage - Supply:
3 V ~ 3.6 V
Package / Case:
44-TSOP (0.400", 10.16mm Width)
Memory Format:
RAM
Technology:
MRAM (Magnetoresistive RAM)
Other Names:
819-1024
Access Time:
35ns
Manufacturer:
Everspin Technologies Inc.
pdf icon
Assembly Subcontractor Revision A 03/Jun/2014(PCN Assembly/Origin)
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Assembly Subcontractor Addition 30/May/2014(PCN Assembly/Origin)
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Mold Compound Update 15/Dec/2014(PCN Design/Specification)


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