SMD291SNL250T5 Chip Quik Inc.

This is manufactured by Chip Quik Inc.. The manufacturer part number is SMD291SNL250T5. It has typical 3 weeks of manufacturer standard lead time. It features lead free no-clean solder paste sn96.5ag3cu0.5 (96.5/3/0.5) jar, 8.8 oz (250g). The product is designed as a nice jar, 8.8 oz (250g). The typical product's weight is 0.551 lb (249.93g). It is a lead free process. It is a no-clean flux. It offers storage features at 37°f ~ 46°f (3°c ~ 8°c). Furthermore, the product is active It has a melting point of 423 ~ 428°f (217 ~ 220°c). It is available in the standard package of 1. The product is highly reliable with a long-lasting period of 6 months (date of manufacture) (refrigerated). Shipping Information: ships with cold pack. to ensure customer satisfaction and product integrity, air shipment is recommended.. It comes in solder paste configuration. It is composed of sn96.5ag3cu0.5 (96.5/3/0.5). The chip quik inc.'s product offers user-desired applications.

RoHs Compliant

Chip Quik Inc. SMD291SNL250T5

Manufacturer:
Chip Quik Inc.
Manufacturer Part No:
SMD291SNL250T5
Enrgtech Part No:
ET11658746
Warranty:
Manufacturer
£ 84.36
Checking for live stock
Manufacturer Standard Lead Time:
3 Weeks
Detailed Description:
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)
Form:
Jar, 8.8 oz (250g)
Weight:
0.551 lb (249.93g)
Process:
Lead Free
Flux Type:
No-Clean
Storage/Refrigeration Temperature:
37°F ~ 46°F (3°C ~ 8°C)
Part Status:
Active
Melting Point:
423 ~ 428°F (217 ~ 220°C)
Standard Package:
1
Shelf Life:
6 Months (Date of Manufacture) (Refrigerated)
Shipping Info:
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type:
Solder Paste
Composition:
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Manufacturer:
Chip Quik Inc.
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SMD291SNL250T5(Datasheets)
pdf icon
SMD291SN(MSDS Material Safety Datasheet)


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