EPC2033 EPC

This is 2033 manufactured by EPC. The manufacturer part number is EPC2033. It has typical 22 weeks of manufacturer standard lead time. It has a maximum Rds On and voltage of 7 mohm @ 25a, 5v. It features n-channel 150v 31a (ta) surface mount die. The product's input capacitance at maximum includes 1140pf @ 75v. The product is available in surface mount configuration. The typical Vgs (th) (max) of the product is 2.5v @ 9ma. Furthermore, the product is active The product egan®, is a highly preferred choice for users. It is available in the standard package of 1. die is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The maximum gate charge and given voltages include 10nc @ 5v. It carries FET type n-channel. Its typical moisture sensitivity level is 1 (unlimited). Moreover, the product comes in [Package/ Case]. The product has a 150v drain to source voltage. The continuous current drain at 25°C is 31a (ta). This product use ganfet (gallium nitride) technology. Alternative Names include 917-1131-1. The epc's product offers user-desired applications.

RoHs Compliant

EPC 2033

Manufacturer:
EPC
Manufacturer Part No:
EPC2033
Enrgtech Part No:
ET11069224
Warranty:
Manufacturer
£ 7.34
Checking for live stock
Manufacturer Standard Lead Time:
22 Weeks
Rds On (Max) @ Id, Vgs:
7 mOhm @ 25A, 5V
Detailed Description:
N-Channel 150V 31A (Ta) Surface Mount Die
Input Capacitance (Ciss) (Max) @ Vds:
1140pF @ 75V
Mounting Type:
Surface Mount
Vgs(th) (Max) @ Id:
2.5V @ 9mA
Part Status:
Active
Series:
eGaN®
Standard Package:
1
Supplier Device Package:
Die
Packaging:
Cut Tape (CT)
Gate Charge (Qg) (Max) @ Vgs:
10nC @ 5V
FET Type:
N-Channel
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Package / Case:
Die
Drain to Source Voltage (Vdss):
150V
Current - Continuous Drain (Id) @ 25°C:
31A (Ta)
Technology:
GaNFET (Gallium Nitride)
Other Names:
917-1131-1
Manufacturer:
EPC
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Site Change 13/Mar/2017(PCN Assembly/Origin)
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EPC2/8 10/Apr/2017(PCN Assembly/Origin)
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EPC2033 Datasheet(Datasheets)
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Die Removal Procedure(Mfg Application Notes)
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Assembling eGaN® FETs(Mfg Application Notes)
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Die Attach Procedure(Mfg Application Notes)
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Using eGaN® FETs(Mfg Application Notes)


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