Glue with low application temperature for heat-sensitive materials, solvent-free, 600 g (20 sticks), Ø 11 mm, for GluePRO 400 LCD, temperature: 130°C, firm after a maximum of 80 seconds, strong bond after approx. 40 seconds. Its low melting temperature makes the Low-Melt adhesive particularly suitable for heat-sensitive materials, such as PU foam and polystyrene. With an application temperature of only 130°C, it protects the base surface it is applied to. The material is firm after a maximum of 80 seconds, with a strong bond being provided after approx. 40 seconds. (Times and recommended adhesive are rough guides only).