The Infineon IDD series schottky diode introduces double DPAK, the first top-side cooled surface mount device package addressing high power SMPS applications such as PC power, solar, server and telecom. It has current rating of 8 A. It provides a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies. Enabling highest energy efficiency
Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
Reduced parasitic source inductance improves efficiency and ease-of-use
Enables higher power density solutions